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Design of bonding system for PCB repairs
Burian, Jaroslav ; Skácel, Josef (referee) ; Otáhal, Alexandr (advisor)
The goal of this thesis is to design a device for PCB repairing, mainly for conductive traces and soldering pads. The design focuses on mechanical construction, control unit and controling of the whole device, which is semiautomatic. A great deal of emphasis is placed on the simplicity and versality of the construction. The teoretic part of this thesis is addressed to the printed circuit board and its repairs. There are presented existing devices for repairing of those defects in the second part. The next part is focused on the design itself in terms of mechanical construction and choosing electrical components. There is described controlling of these components. Part of making mechanical components follows. Last but not least, firmware, which controls whole machine is described there. Finally, the machine was tested in the repair process of the solder pad on the printed circuit board.
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The via interconnection in LTCC
Sedliak, Erik ; Klíma, Martin (referee) ; Kosina, Petr (advisor)
This thesis deals with manufacturing process of LTCC 3D structures. Emphasis is placed mainly on the formation of via interconnections. In the second section of thesis, different via interconnections were designed, created and tested. Aim of this thesis was to evalute impact of via properties on vias function.
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PCB Production and Process Optimizing
Schnederle, Petr ; Blansko, Jiří Zouhar, ČEMEBO (referee) ; Starý, Jiří (advisor)
Bachelor's thesis describes the problems of production of printed circuit boards. It focuses on issues of production 1V and 2V DPS subtractive method pattern plating and related activities. Includes analysis of double-layer PCB using microsection and examples of possible defects in the production. The work is aimed at optimizing the production process in fa Čemebo Blansko Ltd. Shows the deployment of machines and technology flows in the company, then provides recommendations to streamline the flow. It also includes recommendations for retrofitting other appropriate facilities and recommendations for optimization of existing facilities.
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Multichannel HD-SDI digital video signal converter
Kučera, Stanislav ; Bobula, Marek (referee) ; Kubíček, Michal (advisor)
This master’s thesis deals with the design of six channel SD, HD and 3G HD-SDI digital video signal converter to 10-Gigabit Ethernet. In the introductory part, the conception of designed device is formulated. The theoretical background is provided in four chapters, where main standards and design rules related to digital electronics’ design are analyzed. The emphasis is placed on signal integrity at high-speed interconnects. There mostly practical examples, calculations and simulations are utilized. The design part contains thorough description of main subsystems’ design, implementation of FPGA, SDI input channels and 10-Gigabit Ethernet PHY. In the final part, the first tests and measurements of the build prototype are summarized. As an example, the comparison of signal integrity simulation to measurement is provided.
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Design of bonding system for PCB repairs
Burian, Jaroslav ; Skácel, Josef (referee) ; Otáhal, Alexandr (advisor)
The goal of this thesis is to design a device for PCB repairing, mainly for conductive traces and soldering pads. The design focuses on mechanical construction, control unit and controling of the whole device, which is semiautomatic. A great deal of emphasis is placed on the simplicity and versality of the construction. The teoretic part of this thesis is addressed to the printed circuit board and its repairs. There are presented existing devices for repairing of those defects in the second part. The next part is focused on the design itself in terms of mechanical construction and choosing electrical components. There is described controlling of these components. Part of making mechanical components follows. Last but not least, firmware, which controls whole machine is described there. Finally, the machine was tested in the repair process of the solder pad on the printed circuit board.
|
|
|
The via interconnection in LTCC
Sedliak, Erik ; Klíma, Martin (referee) ; Kosina, Petr (advisor)
This thesis deals with manufacturing process of LTCC 3D structures. Emphasis is placed mainly on the formation of via interconnections. In the second section of thesis, different via interconnections were designed, created and tested. Aim of this thesis was to evalute impact of via properties on vias function.
|
|
|
The via interconnection in LTCC
Sedliak, Erik ; Klíma, Martin (referee) ; Kosina, Petr (advisor)
This thesis deals with manufacturing process of LTCC 3D structures. Emphasis is placed mainly on the formation of via interconnections. In the second section of thesis, different via interconnections were designed, created and tested. Aim of this thesis was to evalute impact of via properties on vias function.
|
|
|
PCB Production and Process Optimizing
Schnederle, Petr ; Blansko, Jiří Zouhar, ČEMEBO (referee) ; Starý, Jiří (advisor)
Bachelor's thesis describes the problems of production of printed circuit boards. It focuses on issues of production 1V and 2V DPS subtractive method pattern plating and related activities. Includes analysis of double-layer PCB using microsection and examples of possible defects in the production. The work is aimed at optimizing the production process in fa Čemebo Blansko Ltd. Shows the deployment of machines and technology flows in the company, then provides recommendations to streamline the flow. It also includes recommendations for retrofitting other appropriate facilities and recommendations for optimization of existing facilities.
|
|
|
Multichannel HD-SDI digital video signal converter
Kučera, Stanislav ; Bobula, Marek (referee) ; Kubíček, Michal (advisor)
This master’s thesis deals with the design of six channel SD, HD and 3G HD-SDI digital video signal converter to 10-Gigabit Ethernet. In the introductory part, the conception of designed device is formulated. The theoretical background is provided in four chapters, where main standards and design rules related to digital electronics’ design are analyzed. The emphasis is placed on signal integrity at high-speed interconnects. There mostly practical examples, calculations and simulations are utilized. The design part contains thorough description of main subsystems’ design, implementation of FPGA, SDI input channels and 10-Gigabit Ethernet PHY. In the final part, the first tests and measurements of the build prototype are summarized. As an example, the comparison of signal integrity simulation to measurement is provided.
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